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Storage Temperature : -40°C to +125°C
Operating Ambient Temperature : -40°C to +85°C (without derating)
Maximum Voltage-Temperature Coefficient : < -0.05% / °C
Insulation Resistance : 1000 Mega-ohm minimum
Hi Pot (Leads To case, 1 Min.) : 2500 VDC
Typical Response Time : <25 Nano-seconds
 Epoxy Rating : 94V-0
 Current / Energy Derating (>85°C ) : -2.5% / °C
DC Leakage Current : 200μA maximum (at rated DC working voltage )
Solderability : MIL-STD-202F

Storage Temperature : -40°C to +125°C
Operating Ambient Temperature : -40°C to +85°C (without derating)
Maximum Voltage-Temperature Coefficient : < -0.05% / °C
Insulation Resistance : 1000 Mega-ohm minimum
Hi Pot (Leads To case, 1 Min.) : 2500 VDC
Typical Response Time : <25 Nano-seconds
 Epoxy Rating : 94V-0
 Current / Energy Derating (>85°C ) : -2.5% / °C
DC Leakage Current : 200μA maximum (at rated DC working voltage )
Solderability : MIL-STD-202F

Storage Temperature : -40°C to +125°C
Operating Ambient Temperature : -40°C to +85°C (without derating)
Maximum Voltage-Temperature Coefficient : < -0.05% / °C
Insulation Resistance : 1000 Mega-ohm minimum
Hi Pot (Leads To case, 1 Min.) : 2500 VDC
Typical Response Time : <25 Nano-seconds
 Epoxy Rating : 94V-0
 Current / Energy Derating (>85°C ) : -2.5% / °C
DC Leakage Current : 200μA maximum (at rated DC working voltage )
Solderability : MIL-STD-202F

Storage Temperature : -40°C to +125°C
Operating Temperature : -40°C to +125°C
Maximum Clamping voltage : 20Vc~270Vc@1 A, 8*20 us standard current.
Maximum Capacitance : 3.5pF~10500pF @ 1 KHz.

Storage Temperature : -40°C to +125°C
Operating Temperature : -40°C to +125°C
Maximum Clamping voltage : 34Vc~240Vc@1A, 8*20 us standard current.
Maximum Capacitance : 0.8pF~100pF @ 1 MHz.